The PWB500V is designed for inspection and quality inspection of leadframes and substrates after die attach and wire bonding processes. The system is equipped with a high-speed camera with a global shutter and a 2D visual inspection platform, equipped with a strobe controller, synchronized with the encoder and the camera. The instant scan method with strobe control eliminates waiting time during inspections.
PWB500V Automatic Optical Inspection System after Wire Bonding
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Programmable XY Stage for Flexible Scanning
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Programmable Adaptive Cartridge Elevator and Electric Loader
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High resolution camera up to 5.0MP with 2D vision system
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One-in-one-out double box loader
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Classification of blemishes based on 4 visual tools
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User friendly software control for recipe setting and strip mapping function
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Various types of rejection modules, such as perforation modules, disconnection modules, laser modules, etc. (only one type can be selected)
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TCP-IP and RS232 data interface/SECS/GEM data communication (optional)
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